HELIOS-T
Thermal Overlay Enhancement for Night Vision Systems
The HELIOS‑T (Helios Thermal Overlay System) is a lightweight, field‑ready thermal overlay module engineered to provide night‑vision users with enhanced detection and situational awareness capabilities. Developed as a practical alternative to high‑cost systems such as the AN/PAS‑29B ECOTI, the HELIOS‑T integrates seamlessly with common night‑vision platforms including the PVS‑14, RNVG, BNVD, and other dovetail‑compatible housings.
Utilizing a 256 thermal imaging core paired with a high‑contrast Micro‑OLED 1280×800 projection display, the HELIOS‑T injects a thermal overlay directly into the user’s night‑vision optical path. This blended imagery improves detection, navigation, and environmental awareness in zero‑light, obscured, and complex terrain conditions.
The HELIOS‑T is engineered to deliver dependable performance for training and general night‑vision augmentation while maintaining a compact form factor, simplified controls, and rugged field‑ready construction.
Recent development refinements have reduced overall size by roughly 30% from early prototypes and introduced an integrated PCB architecture with secure internal connectors for improved durability and reliability. A single 5‑position control button provides intuitive access to modes and system settings, while a simplified image‑alignment process allows for quick, once‑and‑done IIT alignment during initial setup. A quick‑release interface enables rapid removal or installation from the NVG mount without tools.
Key FeaturesThermal Overlay System
256 thermal sensor for reliable heat‑signature detection
Micro‑OLED overlay display providing clear blended thermal imagery
Very simple IIT image alignment procedure (set once)
Multiple operating modes:
White Hot
Black Hot
Outline / Edge Detection
Fusion / Highlight
Adjustable gain, brightness, and polarity
Single 5‑position multi‑function control button
Lightweight and Durable Construction
Total system weight: approx. 85 grams
Overall unit size reduced ~30% from early prototypes
High‑temperature polymer housing for strength and thermal stability
Integrated PCB and secure connectors for durability and serviceability
Low‑profile footprint ideal for single‑ and dual‑tube NVG setups
Mounting Compatibility
Quick‑release interface for rapid removal/installation
Mounting options for:
PVS‑14
RNVG / BNVD
Dovetail‑interface NVG systems
Additional adapters planned as production expands
Power and Connectivity
Powered via USB‑C
Supports external USB battery packs or helmet‑mounted power
Efficient electronics designed for extended runtime
USB‑C interface supports firmware updates and future enhancements
Field‑Practical Engineering
Weather‑resistant housing
Rugged construction for outdoor and training environments
Includes Apache hard case for secure storage and transport
Technical Specifications
| Specification | Value |
|---|---|
| Resolution | 1280×800 projection resolution |
| Display | Micro‑OLED digital overlay |
| Thermal Sensor | 256 core |
| Pixel Pitch | 8-14 µm class (sensor dependent) |
| Operating Modes | White Hot, Black Hot, Outline, Fusion/Highlight |
| Control Interface | Single 5‑position button |
| Power Source | USB‑C |
| Runtime | Mode and power‑source dependent |
| Housing Material | High‑temperature polymer |
| Weight | Approx. 85 grams |
| Sensing Range | 1000 Meters |
| Mounting Options | PVS‑14, RNVG/BNVD, dovetail systems |
| Firmware | User‑upgradable |
Purpose
Commercially available thermal‑overlay devices such as the ECOTI offer exceptional performance but are often cost‑prohibitive for many users. The HELIOS‑T is designed to deliver similar functional advantages—thermal augmentation, enhanced navigation, and improved detection capability—within a more accessible, lightweight, and field‑practical system.
Compliance and Legal Notice
The HELIOS‑T is a thermal imaging overlay device intended for lawful use in sporting, training, wildlife observation, and general night‑vision augmentation. Users are responsible for compliance with all local, state, and federal regulations governing night‑vision and thermal imaging equipment. Export or redistribution outside the United States may be restricted.
Lead Time
Current Lead time is 1-3 Weeks.
Lead time updated every Wednesday at 9:00 PM EST.



























